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公开(公告)号：US20240425355A1
公开(公告)日：2024-12-26
申请号：US18242132
申请日：2023-09-05
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Shih-Hsiung TSENG , Shih-Wei LEE , Chao-Shiun WANG
IPC: B81B3/00 , G01C19/5712
Abstract: The present application provides a three-axis gyroscope, which comprises a substrate on which a first plate element, a second plate element, a third plate element, a first drive module, and a second drive module are disposed. The first driving module, the first plate element, the second plate element, the third plate element and the second driving module are disposed in an axial direction. Thereby, problems caused by use of frames and coupling flexible structures of three-axis gyroscopes available now may be solved effectively.
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公开(公告)号：US20240019297A1
公开(公告)日：2024-01-18
申请号：US18129908
申请日：2023-04-03
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Yu-Min Lin
CPC classification number: G01J1/4204 , G01J1/0488
Abstract: The present invention provides an ambient light sensing method and an ambient light sensor. The ambient light sensing method comprises a light sensing device sensing the light passing through an optical filter and giving an optical signal value, and an operational unit receiving the optical signal value and calculating an ambient light illuminance value according to the optical signal value. Accordingly, the ambient light sensing method and the ambient light sensor according to the present invention can give the ambient light illuminance value with more accuracy and ensure low influence of opaque ink on ambient light sensing.
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公开(公告)号：US20240017987A1
公开(公告)日：2024-01-18
申请号：US18129911
申请日：2023-04-03
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Shih-Wei Lee , Kuan-Ju Tseng , Chao-Shiun Wang
CPC classification number: B81B3/0072 , B81C3/001 , B81B2203/0307 , B81C2203/054
Abstract: The present application discloses an anchor structure for application to a microelectromechanical system device comprising a cap layer, a device layer and a substrate layer. Such an anchor structure enhances the stress tolerance of the microelectromechanical system device. The anchor structure comprises a first anchor portion, a second anchor portion and a flexible member located in the device layer. The first anchor portion and the second anchor portion are connected to two sides of the flexible member, respectively. The first anchor is secured to the cap layer by a first bonding portion, and the second anchor is secured to the substrate layer by a second bonding portion.
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公开(公告)号：US20230325034A1
公开(公告)日：2023-10-12
申请号：US18333936
申请日：2023-06-13
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： CHIH-YU LIN
CPC classification number: G06F3/04186 , G06F3/046
Abstract: A proximity sensor and a proximity sensing method are disclosed. The proximity sensor includes a sensing element and a sensing circuit. The sensing circuit is coupled to the sensing element and transmits a first driving signal and a second signal to the sensing element, respectively. The sensing element receives the first driving signal and the second driving signal, respectively, and generates a first sensing signal and a second sensing signal, respectively. The sensing circuit generates a proximity signal according to the first sensing signal and the second sensing signal. The accuracy of sensing the proximity of the human body whether near to the sensor is improved. In addition, the sensing circuit is further coupled to a radio-frequency circuit, and the sensing circuit transmits a driving signal or/and receives a sensing signal according to the state of the radio-frequency circuit, thereby reducing interference of the sensing circuit to the radio-frequency circuit.
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公开(公告)号：US11656120B2
公开(公告)日：2023-05-23
申请号：US17405254
申请日：2021-08-18
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Feng-Jung Hsu
IPC: G01J1/42
CPC classification number: G01J1/42
Abstract: This application provides a structure of the optical sensor, in which a photosensitive element is arranged on a substrate, a colloid layer is arranged on the upper part of the substrate and covers the photosensitive element, and a thin film is further arranged. The device includes an adhesive layer and a light-transmitting layer, the adhesive layer is disposed above one of the colloid layers, the light-transmitting layer is disposed above one of the adhesive layers, and the structure can be used to provide the film member that can be changed according to requirements The optical design reduces the production cost of the optical sensor; this application further provides a shielding layer between the film member and the colloid layer to improve the photosensitive efficiency of the optical sensor.
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Patent Agency Ranking
公开(公告)号：US10985770B2
公开(公告)日：2021-04-20
申请号：US16819583
申请日：2020-03-16
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Jer-Hau Hsu , Tsung-Han Wu , Kian-Fu Wong , Meng-Yong Lin
IPC: H03M1/08
Abstract: The present application relates to a method for operating sensing signals and the circuit thereof. An analog-to-digital converter first processes the input signal having the most significant bit (MSB DATA) data at least once. Afterwards, the analog-to-digital converter processes the input signal having the least significant bit (LSB) data and the MSB data and sums all the input signals. Thereby, the process steps of the analog-to-digital converter can be simplified and the processing time can be shortened.
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公开(公告)号：US11933809B2
公开(公告)日：2024-03-19
申请号：US17658139
申请日：2022-04-06
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Shih-Wei Lee , Chia-Hao Lin , Shih-Hsiung Tseng , Kuan-Ju Tseng , Chao-Shiun Wang
IPC: G01P15/08 , G01P15/125 , G01P15/18
CPC classification number: G01P15/08 , G01P15/125 , G01P15/18
Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.
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公开(公告)号：US20230252936A1
公开(公告)日：2023-08-10
申请号：US18084223
申请日：2022-12-19
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： YEN-CHUNG LIN , RONG-FONG CHEN
CPC classification number: G09G3/32 , G09G3/2092 , G09G2360/14 , G09G2310/08 , G09G2340/0435 , G09G2320/0242 , G09G2320/0247
Abstract: The present application relates to an electronic device comprising: a display unit, a display driver circuit and a circuit element. The display driver circuit is coupled to the display unit. The circuit element is placed under a display area of the display unit. The circuit element receives a dynamic refresh signal generated by the display driver circuit. The dynamic refresh signal contains a refresh rate information of the display unit. Thereby, the problem that the interference between the display pixels and the circuit element under the display unit cannot be avoided when the refresh rate changes is solved.
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公开(公告)号：US20230243697A1
公开(公告)日：2023-08-03
申请号：US17938451
申请日：2022-10-06
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： WEN-CHENG CHEN , KAI-HSIANG CHAN , SHENG-WEN HUANG
CPC classification number: G01J1/46 , G01J1/0228 , G01J2001/446
Abstract: The present application discloses a light sensor circuit, which comprises a photodiode and a capacitor unit. The cathode of the photodiode is controlled by a capacitive unit to maintain the same or close voltage level as the anode of the photodiode, which significantly reduces the effect of the dark current of the photodiode. Thus, the light sensor circuit can effectively maintain the performance and accuracy of an analog-to-digital converter applying the light sensor circuit. The circuit design difficulty and manufacturing cost are also significantly reduced.
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公开(公告)号：US20230228619A1
公开(公告)日：2023-07-20
申请号：US18067066
申请日：2022-12-16
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： YU-MIN LIN , FENG-JUNG HSU
CPC classification number: G01J1/0271 , G01J1/0459 , G01J1/0474 , G01J2001/0276
Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.
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