公开(公告)号：US20240017987A1

公开(公告)日：2024-01-18

申请号：US18129911

申请日：2023-04-03

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Shih-Wei Lee ,  Kuan-Ju Tseng ,  Chao-Shiun Wang

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0072 ,  B81C3/001 ,  B81B2203/0307 ,  B81C2203/054

Abstract: The present application discloses an anchor structure for application to a microelectromechanical system device comprising a cap layer, a device layer and a substrate layer. Such an anchor structure enhances the stress tolerance of the microelectromechanical system device. The anchor structure comprises a first anchor portion, a second anchor portion and a flexible member located in the device layer. The first anchor portion and the second anchor portion are connected to two sides of the flexible member, respectively. The first anchor is secured to the cap layer by a first bonding portion, and the second anchor is secured to the substrate layer by a second bonding portion.

公开(公告)号：US11933809B2

公开(公告)日：2024-03-19

申请号：US17658139

申请日：2022-04-06

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Shih-Wei Lee ,  Chia-Hao Lin ,  Shih-Hsiung Tseng ,  Kuan-Ju Tseng ,  Chao-Shiun Wang

IPC: G01P15/08 ,  G01P15/125 ,  G01P15/18

CPC classification number: G01P15/08 ,  G01P15/125 ,  G01P15/18

Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.

公开(公告)号：US11193770B2

公开(公告)日：2021-12-07

申请号：US17016870

申请日：2020-09-10

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Shih-Wei Lee ,  Chao-Shiun Wang

IPC: G01C19/5712

Abstract: The invention related to a microelectromechanical systems gyroscope, which comprises a plurality of sensing modules sensing angular velocities on tri-axes, a plurality of outer frames set at outside of the sensing modules, and a plurality of driving shafts set between the frames respectively. The driving shafts are connected with two adjacent frames by first and second flexible connecting elements, respectively, and the frames are connected with the sensing modules by a plurality of transporting units. Thus, tri-axes sensing is provided.

公开(公告)号：US11614327B2

公开(公告)日：2023-03-28

申请号：US17383893

申请日：2021-07-23

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Shih-Hsiung Tseng ,  Shih-Wei Lee ,  Chao-Shiun Wang

IPC: G01C19/5663 ,  G01C19/5769

Abstract: The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.