Invention Grant
- Patent Title: Semiconductor devices including a stress pattern
-
Application No.: US16402292Application Date: 2019-05-03
-
Publication No.: US11195952B2Publication Date: 2021-12-07
- Inventor: Sung Min Kim , Hyo Jin Kim , Dae Won Ha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2018-0108380 20180911
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/762

Abstract:
Semiconductor devices are provided. A semiconductor device includes a fin structure including a stress structure and a semiconductor region that are sequentially stacked on a substrate. The semiconductor device includes a field insulation layer on a portion of the fin structure. The semiconductor device includes a gate electrode on the fin structure. Moreover, the stress structure includes an oxide.
Public/Granted literature
- US20200083377A1 SEMICONDUCTOR DEVICES INCLUDING A STRESS PATTERN Public/Granted day:2020-03-12
Information query
IPC分类: