Invention Grant
- Patent Title: Interconnect system having retention features
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Application No.: US16604023Application Date: 2018-04-10
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Publication No.: US11196195B2Publication Date: 2021-12-07
- Inventor: R. Brad Bettman , Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , Edwin Loy
- Applicant: SAMTEC, INC.
- Applicant Address: US IN New Albany
- Assignee: SAMTEC, INC.
- Current Assignee: SAMTEC, INC.
- Current Assignee Address: US IN New Albany
- Agency: BakerHostetler
- International Application: PCT/US2018/026860 WO 20180410
- International Announcement: WO2018/191248 WO 20181018
- Main IPC: H01R12/70
- IPC: H01R12/70 ; G02B6/42 ; H01R12/73
Abstract:
Interconnect systems having anti-backout latches and securement members are disclosed.
Public/Granted literature
- US20200220286A1 INTERCONNECT SYSTEM HAVING RETENTION FEATURES Public/Granted day:2020-07-09
Information query
