DATA COMMUNICATION SYSTEM
    1.
    发明申请

    公开(公告)号:US20250158301A1

    公开(公告)日:2025-05-15

    申请号:US19027626

    申请日:2025-01-17

    Applicant: SAMTEC, INC.

    Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

    Data communication system
    2.
    发明授权

    公开(公告)号:US12230902B2

    公开(公告)日:2025-02-18

    申请号:US17936013

    申请日:2022-09-28

    Applicant: SAMTEC, INC.

    Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

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