公开(公告)号：US20230014513A1

公开(公告)日：2023-01-19

申请号：US17936013

申请日：2022-09-28

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US20220019039A1

公开(公告)日：2022-01-20

申请号：US17386607

申请日：2021-07-28

Applicant: Samtec, Inc.

Inventor： Eric Zbinden

IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

公开(公告)号：US20250158301A1

公开(公告)日：2025-05-15

申请号：US19027626

申请日：2025-01-17

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US12230902B2

公开(公告)日：2025-02-18

申请号：US17936013

申请日：2022-09-28

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US11171432B2

公开(公告)日：2021-11-09

申请号：US16325456

申请日：2017-08-15

Applicant: SAMTEC INC.

Inventor： Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：USD924170S1

公开(公告)日：2021-07-06

申请号：US29733196

申请日：2020-04-30

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：USD960107S1

公开(公告)日：2022-08-09

申请号：US29797618

申请日：2021-07-01

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：US11125956B2

公开(公告)日：2021-09-21

申请号：US16650080

申请日：2018-09-24

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden

IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

公开(公告)号：USD886066S1

公开(公告)日：2020-06-02

申请号：US29628702

申请日：2017-12-06

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：US09841572B2

公开(公告)日：2017-12-12

申请号：US15181762

申请日：2016-06-14

Applicant: Samtec, Inc.

Inventor： Eric Zbinden ,  Randall Musser ,  Jean-Marc André Verdiell ,  John Mongold ,  Brian Vicich ,  Keith Guetig

IPC: G02B6/42 ,  H04B1/3827 ,  H04B10/40 ,  H04B10/27 ,  H04B10/25 ,  H04B10/80 ,  H05K7/20 ,  H01R13/639

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.