Invention Grant
- Patent Title: Mold case and manufacturing method of microneedle array
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Application No.: US16391341Application Date: 2019-04-23
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Publication No.: US11198234B2Publication Date: 2021-12-14
- Inventor: Yoshiki Sakazaki , Kenichiro Tamaki , Toshihiro Usa , Ikuo Takano
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2018-094790 20180516
- Main IPC: B29C39/26
- IPC: B29C39/26 ; B29C39/02 ; B29L31/00

Abstract:
Provided are a mold case that prevents deformation of a microneedle array, and a manufacturing method of a microneedle array. The problems are solved by the manufacturing method of a microneedle array including: a filling step of filling needle-like recessed portions of a mold having flexibility and having a plurality of the needle-like recessed portions on a front surface, with a liquid material; and a drying step of drying the liquid material in a state where the mold filled with the liquid material is stored in the mold case which causes an edge portion of the mold to be sandwiched between the lid and the pedestal.
Public/Granted literature
- US20190351588A1 MOLD CASE AND MANUFACTURING METHOD OF MICRONEEDLE ARRAY Public/Granted day:2019-11-21
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