Invention Grant
- Patent Title: Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
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Application No.: US17006016Application Date: 2020-08-28
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Publication No.: US11202368B2Publication Date: 2021-12-14
- Inventor: Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/09
Abstract:
A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
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