公开(公告)号：US20220329448A1

公开(公告)日：2022-10-13

申请号：US17848881

申请日：2022-06-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Richard Goergen ,  Chad M. Jones ,  Jessica Kiefer ,  Douglas Paul Arduini

IPC: H04L12/10 ,  G06F1/20 ,  G06F1/26 ,  H04L12/28

Abstract: In one embodiment, an apparatus includes a power adapter configured for direct connection to a Power Supply Unit (PSU) installed in a network device, the power adapter comprising a power input port for receiving power on an Ethernet cable, a power converter module for converting the power received at the power input port to a PSU input power, and a power output connector for connection with a PSU power input connector.

公开(公告)号：US12160948B2

公开(公告)日：2024-12-03

申请号：US18337724

申请日：2023-06-20

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

公开(公告)号：US20230354505A1

公开(公告)日：2023-11-02

申请号：US18337724

申请日：2023-06-20

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

公开(公告)号：US11751322B2

公开(公告)日：2023-09-05

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US11330702B2

公开(公告)日：2022-05-10

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US20210337657A1

公开(公告)日：2021-10-28

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US11894936B2

公开(公告)日：2024-02-06

申请号：US17848881

申请日：2022-06-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Richard Goergen ,  Chad M. Jones ,  Jessica Kiefer ,  Douglas Paul Arduini

IPC: H04L12/10 ,  H04L12/28 ,  G06F1/20 ,  G06F1/26

CPC classification number: H04L12/10 ,  G06F1/20 ,  G06F1/266 ,  H04L12/2885

Abstract: In one embodiment, an apparatus includes a power adapter configured for direct connection to a Power Supply Unit (PSU) installed in a network device, the power adapter comprising a power input port for receiving power on an Ethernet cable, a power converter module for converting the power received at the power input port to a PSU input power, and a power output connector for connection with a PSU power input connector.

公开(公告)号：US11706870B2

公开(公告)日：2023-07-18

申请号：US17503690

申请日：2021-10-18

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K3/46 ,  H05K1/09

CPC classification number: H05K1/09 ,  H05K3/4644 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/1545

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US11252811B2

公开(公告)日：2022-02-15

申请号：US16743371

申请日：2020-01-15

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Jessica Kiefer ,  Ashley Julia Maker Erickson ,  Yi Tang ,  M. Baris Dogruoz ,  Elizabeth Ann Kochuparambil ,  Shobhana Punjabi

IPC: H05K1/02 ,  H01R12/71 ,  H05K7/20

Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.

公开(公告)号：US20210337666A1

公开(公告)日：2021-10-28

申请号：US17006016

申请日：2020-08-28

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K1/09 ,  H05K3/46

Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.