Invention Grant
- Patent Title: Semiconductor package and semiconductor apparatus
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Application No.: US16747404Application Date: 2020-01-20
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Publication No.: US11205601B2Publication Date: 2021-12-21
- Inventor: Eung chang Lee , Heeyoub Kang , Haejung Yang , Youngrok Oh , Kitaek Lee , Bong jae Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0071776 20190617
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/367 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; C08G77/04
Abstract:
A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.
Information query
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