公开(公告)号：US11205601B2

公开(公告)日：2021-12-21

申请号：US16747404

申请日：2020-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eung chang Lee ,  Heeyoub Kang ,  Haejung Yang ,  Youngrok Oh ,  Kitaek Lee ,  Bong jae Lee

IPC: H01L23/29 ,  H01L23/367 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  C08G77/04

Abstract: A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.