- 专利标题: Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
-
申请号: US16400073申请日: 2019-05-01
-
公开(公告)号: US11208525B2公开(公告)日: 2021-12-28
- 发明人: Hideyuki Katagi , Kenji Tanaka , Yoshitaka Takezawa , Haruaki Sue , Shinichi Kosugi
- 申请人: HITACHI CHEMICAL COMPANY, LTD.
- 申请人地址: JP Tokyo
- 专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitch, Even, Tabin & Flannery, LLP
- 优先权: JP2014-266106 20141226
- 主分类号: C08G59/24
- IPC分类号: C08G59/24 ; C08J5/18 ; C08G59/62
摘要:
An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
公开/授权文献
信息查询
IPC分类: