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公开(公告)号：US11208525B2
公开(公告)日：2021-12-28
申请号：US16400073
申请日：2019-05-01
摘要： An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
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公开(公告)号：US20150144835A1
公开(公告)日：2015-05-28
申请号：US14411814
申请日：2013-06-20
CPC分类号： C09K5/14 , C08G8/10 , C08G8/12 , C08G8/20 , C08G8/22 , C08G8/24 , C08G8/36 , C08G59/621 , C08G59/688 , C08L61/06 , C08L61/12 , C08L61/14 , C08L63/00
摘要： Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R1, R2, R3, R4 and R5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R1, R2, R3, R4 and R5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R11 and R14 independently represents a hydrogen atom or a hydroxy group; and each of R12 and R13 independently represents a hydrogen atom or an alkyl group.
摘要翻译： 本发明提供一种酚醛树脂组合物，其含有：含有下式（I）表示的羟基苯衍生物的环氧树脂固化剂和具有选自下述式（IIa），（IIa）， IIb），（IIc）和（IId）; 和环氧树脂。 在这些式中，R 1，R 2，R 3，R 4和R 5各自独立地表示羟基，氢原子或烷基; R 1，R 2，R 3，R 4和R 5中的至少两个是羟基; 每个Ar独立地表示选自下列式（IIIa）和（IIIb）中的至少一种： R 11和R 14各自独立地表示氢原子或羟基; R 12和R 13各自独立地表示氢原子或烷基。
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公开(公告)号：US10941241B2
公开(公告)日：2021-03-09
申请号：US16079873
申请日：2016-08-25
发明人： Kenji Tanaka , Yuka Yoshida , Shinichi Kosugi , Shingo Tanaka , Hideyuki Katagi , Haruaki Sue , Yoshitaka Takezawa
摘要： The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.
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公开(公告)号：US10934387B2
公开(公告)日：2021-03-02
申请号：US15539974
申请日：2015-12-25
摘要： An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
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公开(公告)号：US10662279B2
公开(公告)日：2020-05-26
申请号：US16079840
申请日：2016-08-25
发明人： Yuka Yoshida , Kenji Tanaka , Hideyuki Katagi , Yoshihiro Amano , Shinichi Kosugi , Haruaki Sue , Yoshitaka Takezawa
IPC分类号： C08G59/24 , C08K3/22 , C08K3/28 , C08K3/36 , C08L61/12 , C08L63/00 , C08G59/62 , C08K3/38 , C08K5/54 , C08L63/04 , C08K5/544 , C08K5/101 , C08K5/5415
摘要： Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.
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公开(公告)号：US10000679B2
公开(公告)日：2018-06-19
申请号：US14411814
申请日：2013-06-20
IPC分类号： B32B27/38 , C08L63/00 , C08G59/24 , C08G59/62 , C09K5/14 , C08G8/20 , C08G8/36 , C08G59/68 , C08G8/10 , C08G8/12 , C08G8/22 , C08G8/24 , C08L61/06 , C08L61/12 , C08L61/14 , H01L23/29 , H01L23/31
CPC分类号： C09K5/14 , C08G8/10 , C08G8/12 , C08G8/20 , C08G8/22 , C08G8/24 , C08G8/36 , C08G59/621 , C08G59/688 , C08L61/06 , C08L61/12 , C08L61/14 , C08L63/00
摘要： Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R1, R2, R3, R4 and R5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R1, R2, R3, R4 and R5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R11 and R14 independently represents a hydrogen atom or a hydroxy group; and each of R12 and R13 independently represents a hydrogen atom or an alkyl group.
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