Invention Grant
- Patent Title: Microetching agent for copper, copper surface roughening method and wiring board production method
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Application No.: US16646604Application Date: 2018-08-20
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Publication No.: US11208726B2Publication Date: 2021-12-28
- Inventor: Yuki Ogino , Takahiro Sakamoto , Kaoru Urushibata
- Applicant: MEC COMPANY LTD.
- Applicant Address: JP Hyogo
- Assignee: MEC COMPANY LTD.
- Current Assignee: MEC COMPANY LTD.
- Current Assignee Address: JP Hyogo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-183064 20170922
- International Application: PCT/JP2018/030714 WO 20180820
- International Announcement: WO2019/058835 WO 20190328
- Main IPC: C23F1/18
- IPC: C23F1/18 ; C23C22/52 ; H05K3/38

Abstract:
A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
Public/Granted literature
- US20200263308A1 MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND WIRING BOARD PRODUCTION METHOD Public/Granted day:2020-08-20
Information query
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