公开(公告)号：US20240270763A1

公开(公告)日：2024-08-15

申请号：US18411521

申请日：2024-01-12

Applicant: MEC COMPANY LTD.

Inventor： Koki MORIKAWA ,  Yuki Ogino ,  Jun Nishimine

IPC: C07F7/18 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  C07D251/54 ,  C08J5/12

CPC classification number: C07F7/1804 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  C07D251/54 ,  C08J5/12 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  C08J2363/00

Abstract: Provided is a chemical compound represented by the general formula (A), in which each of substituents Q1 to Q6 is bonded to a nitrogen atom of melamine backbone. In the general formula (A), at least one of Q1 to Q6 is X, and at least one of Q1 to Q6 is Y. R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R2 is a hydrogen atom, or a monovalent hydrocarbon group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 25 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. Each of R51 and R52 is a divalent organic group, and a is an integer of 1 to 3.

公开(公告)号：US09011712B2

公开(公告)日：2015-04-21

申请号：US14360783

申请日：2013-06-25

Applicant: Mec Company Ltd.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura ,  Yuki Ogino

IPC: C09K13/00 ,  C23F1/18 ,  H05K3/38 ,  H05K3/06

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 公开了一种微蚀刻溶液，添加到所述微蚀刻溶液中的补充溶液和使用所述微蚀刻溶液生产布线板的方法。 用于铜的微蚀刻溶液由含有铜离子，有机酸，卤离子，聚合物和非离子表面活性剂的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 在本发明的微蚀刻溶液中，A / B的值为2000〜9000，A / D的值为500〜9000，卤化物离子的浓度为A％（重量），聚合物的浓度为 B重量％，非离子表面活性剂的浓度为D重量％。 使用该微蚀刻溶液，即使在低蚀刻量下也能均匀地保持对树脂等的粘附。

公开(公告)号：US11208726B2

公开(公告)日：2021-12-28

申请号：US16646604

申请日：2018-08-20

Applicant: MEC COMPANY LTD.

Inventor： Yuki Ogino ,  Takahiro Sakamoto ,  Kaoru Urushibata

IPC: C23F1/18 ,  C23C22/52 ,  H05K3/38

Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.

公开(公告)号：US20140326696A1

公开(公告)日：2014-11-06

申请号：US14360783

申请日：2013-06-25

Applicant: MEC COMPANY LTD.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura ,  Yuki Ogino

IPC: C23F1/18 ,  H05K3/06

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of AB is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 公开了一种微蚀刻溶液，添加到所述微蚀刻溶液中的补充溶液和使用所述微蚀刻溶液生产布线板的方法。 用于铜的微蚀刻溶液由含有铜离子，有机酸，卤离子，聚合物和非离子表面活性剂的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 在本发明的微蚀刻溶液中，AB的值为2000〜9000，A / D的值为500〜9000，卤化物离子的浓度为A％（重量），聚合物的浓度为B％ ，非离子表面活性剂的浓度为D重量％。 使用该微蚀刻溶液，即使在低蚀刻量下也能均匀地保持对树脂等的粘附。

公开(公告)号：US20180044801A1

公开(公告)日：2018-02-15

申请号：US15550752

申请日：2016-01-21

Applicant: MEC COMPANY LTD.

Inventor： Yuki Ogino ,  Mami Tojima ,  Masahiro Hayashizaki ,  Minoru Otani

IPC: C23F1/26 ,  C23F1/44

CPC classification number: C23F1/26 ,  C23F1/44 ,  H01L21/32133 ,  H05K3/108

Abstract: An object of the present invention is to provide: an etching liquid which is capable of etching titanium selectively in the presence of copper, and is further low in toxicity and excellent in storage stability; and an etching method using this etching liquid. The etching liquid of the present invention which is a liquid includes at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid, and at least one organic sulfur compound selected from the group consisting of a thioketone compound and a thioether compound, and makes it possible to etch titanium selectively in the presence of copper.