Invention Grant
- Patent Title: Polishing liquid, method for manufacturing glass substrate, and method for manufacturing magnetic disk
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Application No.: US16641185Application Date: 2018-10-31
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Publication No.: US11214713B2Publication Date: 2022-01-04
- Inventor: Toshio Takizawa
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JPJP2017-210817 20171031
- International Application: PCT/JP2018/040610 WO 20181031
- International Announcement: WO2019/088209 WO 20190509
- Main IPC: C09G1/02
- IPC: C09G1/02 ; G11B5/73 ; B24B7/24 ; C03C17/00 ; G11B5/84
Abstract:
Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.
Public/Granted literature
- US20200208015A1 POLISHING LIQUID, METHOD FOR MANUFACTURING GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING MAGNETIC DISK Public/Granted day:2020-07-02
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