Invention Grant
- Patent Title: Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
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Application No.: US16741030Application Date: 2020-01-13
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Publication No.: US11216632B2Publication Date: 2022-01-04
- Inventor: Quy Chau , Mei-Lin Chan , Xiaoyue Jiang
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06F3/043

Abstract:
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation for imaging a plurality of pixels at a plurality of positions within the two-dimensional array of ultrasonic transducers. For imaging a pixel of the plurality of pixels, the array controller is configured to activate a first subset of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to generate an ultrasonic beam directed to a contact surface of the contact layer, and activate a second subset of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to receive a reflected ultrasonic beam, wherein the second subset of ultrasonic transducers is at a location within the two-dimensional array of ultrasonic transducers to account for a local angle between the two-dimensional array of ultrasonic transducers and the contact surface where the ultrasonic beam interacts with the contact surface.
Public/Granted literature
- US20210019487A1 ULTRASONIC FINGERPRINT SENSOR WITH A CONTACT LAYER OF NON-UNIFORM THICKNESS Public/Granted day:2021-01-21
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