Invention Grant
- Patent Title: Semiconductor transistor and fabrication method thereof
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Application No.: US16711442Application Date: 2019-12-12
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Publication No.: US11217693B2Publication Date: 2022-01-04
- Inventor: Chang-Po Hsiung , Shin-Hung Li
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201911188611.2 20191128
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/28 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor transistor includes a first lightly doped-drain region disposed in a drain region of a semiconductor substrate; a first heavily doped region disposed in the first lightly doped-drain region; and a gate located on the channel region; a gate oxide layer between the gate and the channel region; and a first insulating feature disposed in the first lightly doped-drain region between the channel region and the first heavily doped region. The gate overlaps with the first insulating feature. The thickness of the first insulating feature is greater than that of the gate oxide layer.
Public/Granted literature
- US20210167208A1 SEMICONDUCTOR TRANSISTOR AND FABRICATION METHOD THEREOF Public/Granted day:2021-06-03
Information query
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