Invention Grant
- Patent Title: Soldering process method
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Application No.: US16106007Application Date: 2018-08-21
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Publication No.: US11219972B2Publication Date: 2022-01-11
- Inventor: Shu-Han Wu , Hung-Wen Chen , Qi-Ming Huang , Yang-Hao Chou , Yun-Chung Sun
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: CN201810245525.X 20180323
- Main IPC: B23K31/00
- IPC: B23K31/00 ; G16C20/00 ; B23K31/12 ; B23K26/20 ; G16C20/70

Abstract:
A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.
Public/Granted literature
- US20190291217A1 SOLDERING PROCESS METHOD Public/Granted day:2019-09-26
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