公开(公告)号：US11219972B2

公开(公告)日：2022-01-11

申请号：US16106007

申请日：2018-08-21

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shu-Han Wu ,  Hung-Wen Chen ,  Qi-Ming Huang ,  Yang-Hao Chou ,  Yun-Chung Sun

IPC: B23K31/00 ,  G16C20/00 ,  B23K31/12 ,  B23K26/20 ,  G16C20/70

Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.