Soldering process parameter suggestion method and system thereof

    公开(公告)号:US11599803B2

    公开(公告)日:2023-03-07

    申请号:US16355867

    申请日:2019-03-18

    Abstract: A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next soldering process when the final product does not meet the quality control requirements.

    Laser soldering system and light shaping method thereof

    公开(公告)号:US12214436B2

    公开(公告)日:2025-02-04

    申请号:US17643189

    申请日:2021-12-08

    Abstract: A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.

    Laser soldering device and laser soldering method

    公开(公告)号:US11465234B2

    公开(公告)日:2022-10-11

    申请号:US17028088

    申请日:2020-09-22

    Abstract: A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

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