- 专利标题: Dual in-line memory modules (DIMM) connector towers with removable and/or lay-flat latches
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申请号: US16739006申请日: 2020-01-09
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公开(公告)号: US11228126B2公开(公告)日: 2022-01-18
- 发明人: Guixiang Tan , Xiang Li , Casey Winkel
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01R12/73
- IPC分类号: H01R12/73 ; H01R43/26 ; H01R12/70
摘要:
Embodiments are directed towards apparatuses, methods, and systems for a connector having a housing body to couple a dual in-line memory module (DIMM) to a printed circuit board (PCB). In embodiments, the housing body includes first and second opposing ends of the connector and a first and a second latch coupled at the respective first and second opposing ends of the connector to engage the DIMM. In embodiments, the first and the second opposing ends have respective first and second heights relative to a height of the housing body to allow the DIMM to be inserted or removed at an angle when disengaged from the first and second latch. In embodiments, one or more of the latches are removably coupled to the connector and/or can be rotated into a lay-flat position to allow the DIMM to be removed at an angle. Additional embodiments may be described and claimed.
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