公开(公告)号：US11228126B2

公开(公告)日：2022-01-18

申请号：US16739006

申请日：2020-01-09

申请人： Intel Corporation

发明人： Guixiang Tan ,  Xiang Li ,  Casey Winkel

IPC分类号： H01R12/73 ,  H01R43/26 ,  H01R12/70

摘要： Embodiments are directed towards apparatuses, methods, and systems for a connector having a housing body to couple a dual in-line memory module (DIMM) to a printed circuit board (PCB). In embodiments, the housing body includes first and second opposing ends of the connector and a first and a second latch coupled at the respective first and second opposing ends of the connector to engage the DIMM. In embodiments, the first and the second opposing ends have respective first and second heights relative to a height of the housing body to allow the DIMM to be inserted or removed at an angle when disengaged from the first and second latch. In embodiments, one or more of the latches are removably coupled to the connector and/or can be rotated into a lay-flat position to allow the DIMM to be removed at an angle. Additional embodiments may be described and claimed.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

申请人： Intel Corporation

发明人： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC分类号： H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

摘要： Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.