Invention Grant
- Patent Title: Self-aligned gate endcap (SAGE) architectures with gate-all-around devices
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Application No.: US16017966Application Date: 2018-06-25
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Publication No.: US11233152B2Publication Date: 2022-01-25
- Inventor: Biswajeet Guha , William Hsu , Leonard P. Guler , Dax M. Crum , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L21/8234 ; H01L23/522 ; H01L29/06 ; H01L29/08 ; H01L29/423

Abstract:
Self-aligned gate endcap (SAGE) architectures with gate-all-around devices, and methods of fabricating self-aligned gate endcap (SAGE) architectures with gate-all-around devices, are described. In an example, an integrated circuit structure includes a semiconductor fin above a substrate and having a length in a first direction. A nanowire is over the semiconductor fin. A gate structure is over the nanowire and the semiconductor fin, the gate structure having a first end opposite a second end in a second direction, orthogonal to the first direction. A pair of gate endcap isolation structures is included, where a first of the pair of gate endcap isolation structures is spaced equally from a first side of the semiconductor fin as a second of the pair of gate endcap isolation structures is spaced from a second side of the semiconductor fin.
Public/Granted literature
- US20190393352A1 SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH GATE-ALL-AROUND DEVICES Public/Granted day:2019-12-26
Information query
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