Invention Grant
- Patent Title: Print liquid interconnects with rotary motion damper
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Application No.: US16607976Application Date: 2018-07-13
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Publication No.: US11235581B2Publication Date: 2022-02-01
- Inventor: Judson M. Leiser , James Ring , Jeffrey L. Thielman
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2018/042049 WO 20180713
- International Announcement: WO2020/013859 WO 20200116
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
In one example in accordance with the present disclosure, an interconnect on a print liquid supply is described. The interconnect includes a liquid interface to establish a liquid path between the print liquid supply and an ejection device in which the print liquid supply is installed. The interconnect also includes an electrical interface to establish a data transmission path between the print liquid supply and the ejection device. The interconnect also includes an external surface having a dampening element disposed thereon.
Public/Granted literature
- US20210291541A1 PRINT LIQUID INTERCONNECTS WITH ROTARY MOTION DAMPER Public/Granted day:2021-09-23
Information query
IPC分类: