公开(公告)号：US11235581B2

公开(公告)日：2022-02-01

申请号：US16607976

申请日：2018-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Judson M. Leiser ,  James Ring ,  Jeffrey L. Thielman

IPC: B41J2/175

Abstract: In one example in accordance with the present disclosure, an interconnect on a print liquid supply is described. The interconnect includes a liquid interface to establish a liquid path between the print liquid supply and an ejection device in which the print liquid supply is installed. The interconnect also includes an electrical interface to establish a data transmission path between the print liquid supply and the ejection device. The interconnect also includes an external surface having a dampening element disposed thereon.

公开(公告)号：US20210291541A1

公开(公告)日：2021-09-23

申请号：US16607976

申请日：2018-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Judson M. Leiser ,  James Ring ,  Jeffrey L. Thielman

IPC: B41J2/175

Abstract: In one example in accordance with the present disclosure, an interconnect on a print liquid supply is described. The interconnect includes a liquid interface to establish a liquid path between the print liquid supply and an ejection device in which the print liquid supply is installed. The interconnect also includes an electrical interface to establish a data transmission path between the print liquid supply and the ejection device. The interconnect also includes an external surface having a dampening element disposed thereon.