Invention Grant
- Patent Title: Methods and systems to enhance process uniformity
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Application No.: US15581446Application Date: 2017-04-28
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Publication No.: US11239061B2Publication Date: 2022-02-01
- Inventor: Saravjeet Singh , Alan Tso , Jingchun Zhang , Zihui Li , Hanshen Zhang , Dmitry Lubomirsky
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67
Abstract:
A semiconductor processing chamber may include a remote plasma region, and a processing region fluidly coupled with the remote plasma region. The processing region may be configured to house a substrate on a support pedestal. The support pedestal may include a first material at an interior region of the pedestal. The support pedestal may also include an annular member coupled with a distal portion of the pedestal or at an exterior region of the pedestal. The annular member may include a second material different from the first material.
Public/Granted literature
- US20170229291A1 METHODS AND SYSTEMS TO ENHANCE PROCESS UNIFORMITY Public/Granted day:2017-08-10
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