Invention Grant
- Patent Title: Bonded assembly containing laterally bonded bonding pads and methods of forming the same
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Application No.: US16694400Application Date: 2019-11-25
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Publication No.: US11239204B2Publication Date: 2022-02-01
- Inventor: Chen Wu , Peter Rabkin , Yangyin Chen , Masaaki Higashitani
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX Addison
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Addison
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/18 ; H01L23/00 ; H01L25/00
Abstract:
A bonded assembly includes a first die containing first bonding pads having sidewalls that are laterally bonded to sidewalls of second bonding pads of a second die.
Public/Granted literature
- US20210159215A1 BONDED ASSEMBLY CONTAINING LATERALLY BONDED BONDING PADS AND METHODS OF FORMING THE SAME Public/Granted day:2021-05-27
Information query
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