- 专利标题: Composite sensor and manufacturing method thereof
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申请号: US16790784申请日: 2020-02-14
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公开(公告)号: US11243226B2公开(公告)日: 2022-02-08
- 发明人: Senlin Li
- 申请人: AUTOCHIPS WUHAN CO., LTD.
- 申请人地址: CN Wuhan
- 专利权人: AUTOCHIPS WUHAN CO., LTD.
- 当前专利权人: AUTOCHIPS WUHAN CO., LTD.
- 当前专利权人地址: CN Wuhan
- 优先权: CN201910272024.5 20190404
- 主分类号: G01P15/125
- IPC分类号: G01P15/125 ; G01P1/02 ; G01L9/00 ; G01P15/12 ; G01L19/00 ; G01L27/00 ; G01P15/08
摘要:
The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.
公开/授权文献
- US20200319228A1 COMPOSITE SENSOR AND MANUFACTURING METHOD THEREOF 公开/授权日:2020-10-08
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