公开(公告)号：US11243226B2

公开(公告)日：2022-02-08

申请号：US16790784

申请日：2020-02-14

申请人： AUTOCHIPS WUHAN CO., LTD.

发明人： Senlin Li

IPC分类号： G01P15/125 ,  G01P1/02 ,  G01L9/00 ,  G01P15/12 ,  G01L19/00 ,  G01L27/00 ,  G01P15/08

摘要： The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.