Invention Grant
- Patent Title: Intra-module serial communication interface for radio frequency devices
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Application No.: US17003724Application Date: 2020-08-26
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Publication No.: US11243902B2Publication Date: 2022-02-08
- Inventor: Reza Rodd , Scott Davenport , Umesh Srikantiah , ZhenQi Chen
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42 ; H04B1/40

Abstract:
Systems, methods, and apparatus for improving bus latency and reducing bus congestion are described. A data communication apparatus has a first interface circuit configured to couple the data communication apparatus to a primary serial bus, a second interface circuit configured to couple the data communication apparatus to a plurality of secondary serial buses, and a sequencer configured to respond to a first command received from the primary serial bus by initiating execution of a preconfigured sequence that causes a sequence of commands to be transmitted through the second interface circuit. The sequence of commands may be configured or selected to access registers in at least one device that is coupled to one of the secondary serial buses.
Public/Granted literature
- US20210081348A1 INTRA-MODULE SERIAL COMMUNICATION INTERFACE FOR RADIO FREQUENCY DEVICES Public/Granted day:2021-03-18
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