Invention Grant
- Patent Title: Package structure and method for manufacturing the same
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Application No.: US16817407Application Date: 2020-03-12
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Publication No.: US11244909B2Publication Date: 2022-02-08
- Inventor: Fan-Yu Min , Chen-Hung Lee , Wei-Hang Tai , Yuan-Tzuo Luo , Wen-Yuan Chuang , Chun-Cheng Kuo , Chin-Li Kao
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/16 ; H01L23/31 ; H01L23/538 ; H01L21/48 ; H01L21/56
Abstract:
A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 μm.
Public/Granted literature
- US20210287999A1 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-09-16
Information query
IPC分类:
