- 专利标题： Bond pads of semiconductor devices
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申请号： US16669531申请日： 2019-10-31
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公开(公告)号： US11244915B2公开(公告)日： 2022-02-08
- 发明人: Ramasamy Chockalingam , Juan Boon Tan , Chee Kong Leong , Ranjan Rajoo , Xuesong Rao , Xiaodong Li
- 申请人： GLOBALFOUNDRIES Singapore Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： GLOBALFOUNDRIES Singapore Pte. Ltd.
- 当前专利权人： GLOBALFOUNDRIES Singapore Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： GlobalFoundries Singapore Pte.
- 代理商 Anthony Canale
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A semiconductor device is provided that includes a dielectric layer, a bond pad, a passivation layer and a planar barrier. The bond pad is positioned in the dielectric layer. The passivation layer is positioned over the dielectric layer and has an opening over the bond pad. The planar barrier is positioned on the bond pad.
公开/授权文献
- US20210134742A1 BOND PADS OF SEMICONDUCTOR DEVICES 公开/授权日：2021-05-06
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