Invention Grant
- Patent Title: Methods of co-bonding a first thermoset composite and a second thermoset composite to define a cured composite part
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Application No.: US16484793Application Date: 2018-03-15
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Publication No.: US11247409B2Publication Date: 2022-02-15
- Inventor: Karl M. Nelson , Travis James Sherwood , Hardik Dalal , Felix N. Nguyen , Dongyeon Lee , Kenichi Yoshioka , Hideo Andrew Koyanagi
- Applicant: The Boeing Company , Toray Industries, Inc.
- Applicant Address: US IL Chicago; JP Tokyo
- Assignee: The Boeing Company,Toray Industries, Inc.
- Current Assignee: The Boeing Company,Toray Industries, Inc.
- Current Assignee Address: US IL Chicago; JP Tokyo
- Agency: Dascenzo Gates Intellectual Property Law, P.C.
- International Application: PCT/US2018/022748 WO 20180315
- International Announcement: WO2018/170330 WO 20180920
- Main IPC: B32B41/00
- IPC: B32B41/00 ; B29C65/00 ; B29C65/02 ; B29C65/48 ; B29L31/30

Abstract:
Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.
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