Invention Grant
- Patent Title: Method and device for monitoring dicing tape tension
-
Application No.: US16800192Application Date: 2020-02-25
-
Publication No.: US11251097B2Publication Date: 2022-02-15
- Inventor: Walter Leitgeb , Daniel Brunner , Lukas Ferlan
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP19160710 20190305
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/683 ; G01L1/24 ; H01L21/67
Abstract:
A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.
Public/Granted literature
- US20200286795A1 Method and Device for Monitoring Dicing Tape Tension Public/Granted day:2020-09-10
Information query
IPC分类:
