公开(公告)号：US11251097B2

公开(公告)日：2022-02-15

申请号：US16800192

申请日：2020-02-25

Applicant: Infineon Technologies AG

Inventor： Walter Leitgeb ,  Daniel Brunner ,  Lukas Ferlan

IPC: H01L21/66 ,  H01L21/683 ,  G01L1/24 ,  H01L21/67

Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.

公开(公告)号：US11088009B2

公开(公告)日：2021-08-10

申请号：US16514632

申请日：2019-07-17

Applicant: Infineon Technologies AG

Inventor： Bernhard Goller ,  Walter Leitgeb ,  Daniel Brunner ,  Lukas Ferlan ,  Markus Ottowitz

IPC: H01L21/683 ,  H01L21/67 ,  B32B38/00 ,  B32B37/12 ,  H01L21/78

Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.

公开(公告)号：US20200286795A1

公开(公告)日：2020-09-10

申请号：US16800192

申请日：2020-02-25

Applicant: Infineon Technologies AG

Inventor： Walter Leitgeb ,  Daniel Brunner ,  Lukas Ferlan

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  G01L1/24

Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.

公开(公告)号：US20200027774A1

公开(公告)日：2020-01-23

申请号：US16514632

申请日：2019-07-17

Applicant: Infineon Technologies AG

Inventor： Bernhard Goller ,  Walter Leitgeb ,  Daniel Brunner ,  Lukas Ferlan ,  Markus Ottowitz

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/78 ,  B32B38/00 ,  B32B37/12

Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.