发明授权
- 专利标题： Photocoupler
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申请号： US16710226申请日： 2019-12-11
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公开(公告)号： US11251327B2公开(公告)日： 2022-02-15
- 发明人: Poh-Loong Chew , Min-Chung Chiu
- 申请人： CT Micro International Corporation
- 申请人地址： KY Grand Cayman
- 专利权人： CT Micro International Corporation
- 当前专利权人： CT Micro International Corporation
- 当前专利权人地址： KY Grand Cayman
- 代理机构： Kelly, Holt & Christenson PLLC
- 代理商 Christopher R. Christenson
- 优先权： TW107146742 20181224
- 主分类号： H01L31/16
- IPC分类号： H01L31/16 ; H01L31/0232 ; H01L31/02 ; H01L23/495 ; H01L25/16
摘要：
Disclosed is a photocoupler comprising: at least two lead frames; an optical channel structure including a light-emitting chip, a light-sensing chip, and a light-transmissive encapsulant body, wherein the light-emitting chip and the light-sensing chip are mounted and bonded on the lead frame and are coplanar, a light-emitting surface of the light-emitting chip and a light-sensing surface of the light-sensing chip face toward the same direction, the light-transmissive encapsulant body encloses the light-emitting chip and the light-sensing chip; and a light-reflecting package encloses the light-transmitting package, and all enclosing contact surface where the light-reflecting outer package contacts the light-transmissive encapsulant body is an optical reflective surface, wherein the light-reflecting encapsulant body and the light-transmissive encapsulant body are formed by double molding and epoxy molding, so that the light-transmissive encapsulant body and the light-reflecting encapsulant body are easy to be shaped.
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