公开(公告)号：US11251327B2

公开(公告)日：2022-02-15

申请号：US16710226

申请日：2019-12-11

申请人： CT Micro International Corporation

发明人： Poh-Loong Chew ,  Min-Chung Chiu

IPC分类号： H01L31/16 ,  H01L31/0232 ,  H01L31/02 ,  H01L23/495 ,  H01L25/16

摘要： Disclosed is a photocoupler comprising: at least two lead frames; an optical channel structure including a light-emitting chip, a light-sensing chip, and a light-transmissive encapsulant body, wherein the light-emitting chip and the light-sensing chip are mounted and bonded on the lead frame and are coplanar, a light-emitting surface of the light-emitting chip and a light-sensing surface of the light-sensing chip face toward the same direction, the light-transmissive encapsulant body encloses the light-emitting chip and the light-sensing chip; and a light-reflecting package encloses the light-transmitting package, and all enclosing contact surface where the light-reflecting outer package contacts the light-transmissive encapsulant body is an optical reflective surface, wherein the light-reflecting encapsulant body and the light-transmissive encapsulant body are formed by double molding and epoxy molding, so that the light-transmissive encapsulant body and the light-reflecting encapsulant body are easy to be shaped.