Invention Grant
- Patent Title: Composite multi-stack seed layer to improve PMA for perpendicular magnetic pinning
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Application No.: US16806193Application Date: 2020-03-02
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Publication No.: US11251367B2Publication Date: 2022-02-15
- Inventor: Yimin Guo , Rongfu Xiao , Jun Chen
- Applicant: Yimin Guo , Rongfu Xiao , Jun Chen
- Applicant Address: US CA San Jose; US CA Dublin; US CA Fremont
- Assignee: Yimin Guo,Rongfu Xiao,Jun Chen
- Current Assignee: Yimin Guo,Rongfu Xiao,Jun Chen
- Current Assignee Address: US CA San Jose; US CA Dublin; US CA Fremont
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/10 ; H01L27/22 ; H01L43/12 ; H01L43/08

Abstract:
The invention comprises a novel composite multi-stack seed layer (CMSL) having lattice constant matched crystalline structure with the Co layer in above perpendicular magnetic pinning layer (pMPL) so that an excellent epitaxial growth of magnetic super lattice pinning layer [Co/(Pt, Pd or Ni)]n along its FCC (111) orientation can be achieved, resulting in a significant enhancement of perpendicular magnetic anisotropy (PMA) for perpendicular spin-transfer-torque magnetic-random-access memory (pSTT-MRAM) using perpendicular magnetoresistive elements as basic memory cells which potentially replace the conventional semiconductor memory used in electronic chips, especially mobile chips for power saving and non-volatility.
Public/Granted literature
- US20210273157A1 COMPOSITE MULTI-STACK SEED LAYER TO IMPROVE PMA FOR PERPENDICULAR MAGNETIC PINNING Public/Granted day:2021-09-02
Information query
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