- 专利标题: Component mounting system and tape scraps collecting device
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申请号: US16930458申请日: 2020-07-16
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公开(公告)号: US11254456B2公开(公告)日: 2022-02-22
- 发明人: Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
- 申请人: Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址: JP Osaka
- 专利权人: Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人: Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Pearne & Gordon LLP
- 优先权: JPJP2018-079725 20180418,JPJP2018-079726 20180418
- 主分类号: H05K13/02
- IPC分类号: H05K13/02 ; H05K13/04 ; B65G47/68 ; B65B15/04
摘要:
There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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