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Patent Agency Ranking
公开(公告)号：US12246869B2
公开(公告)日：2025-03-11
申请号：US18637720
申请日：2024-04-17
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US11584552B2
公开(公告)日：2023-02-21
申请号：US17647196
申请日：2022-01-06
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US11254456B2
公开(公告)日：2022-02-22
申请号：US16930458
申请日：2020-07-16
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US11987408B2
公开(公告)日：2024-05-21
申请号：US18339403
申请日：2023-06-22
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
CPC classification number: B65B15/04 , B65G47/68 , H05K13/02 , H05K13/0417
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US11724842B2
公开(公告)日：2023-08-15
申请号：US18150874
申请日：2023-01-06
Inventor： Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
CPC classification number: B65B15/04 , B65G47/68 , H05K13/02 , H05K13/0417
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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