Invention Grant
- Patent Title: Cleaning method and substrate processing apparatus
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Application No.: US16409441Application Date: 2019-05-10
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Publication No.: US11264260B2Publication Date: 2022-03-01
- Inventor: Takehiro Tanikawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2018-093308 20180514
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; H01L21/67 ; B08B5/02 ; B08B6/00
Abstract:
A method is for cleaning an edge ring. The edge ring includes an inner edge ring provided near a substrate mounted on an electrostatic chuck in a processing chamber, a central edge ring that is provided at an outer side of the inner edge ring and vertically movable by a moving mechanism, and an outer edge ring provided at an outer side of the central edge ring. The method includes applying a direct current voltage to the electrostatic chuck, and moving the central edge ring upward or downward.
Information query
IPC分类:
