Invention Grant
- Patent Title: Thin film processing apparatus and thin film processing method
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Application No.: US16434256Application Date: 2019-06-07
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Publication No.: US11268192B2Publication Date: 2022-03-08
- Inventor: Woo Jin Kim , Dong Kyun Ko , Keun Hee Park , Myung Soo Huh , Seon Uk Park
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0071793 20180622
- Main IPC: C23C16/40
- IPC: C23C16/40 ; C23C16/455 ; C23C16/50 ; H01L51/56

Abstract:
A thin film processing apparatus includes a susceptor and a showerhead facing the susceptor. The showerhead includes a first plate including an inner tunnel, a first injection hole, and a second injection hole. The inner tunnel extends across the first plate in a thickness direction of the first plate. The first injection hole penetrates a first surface and a second surface of the first plate on opposite sides of the first plate in the thickness direction. The second injection hole penetrates the second surface of the first plate. The second injection is connected with the inner tunnel.
Public/Granted literature
- US20190390342A1 THIN FILM PROCESSING APPARATUS AND THIN FILM PROCESSING METHOD Public/Granted day:2019-12-26
Information query
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