Invention Grant
- Patent Title: Fan module
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Application No.: US17006955Application Date: 2020-08-31
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Publication No.: US11268535B2Publication Date: 2022-03-08
- Inventor: Hsin-Chen Lin , Ing-Jer Chiou
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW108131744 20190903
- Main IPC: F04D17/16
- IPC: F04D17/16 ; F04D29/28 ; F04D29/62 ; F04D29/32 ; H05K7/20
Abstract:
A fan module includes a hub, a first body and a second body. The hub is configured to rotate along a central axis. The first body is connected to an outer wall of the hub. The second body is sleeved on the outer wall of the hub. The second body includes a plurality of ribs. The ribs are disposed on an inner wall of the second body and abut against the outer wall of the hub.
Public/Granted literature
- US20210062820A1 FAN MODULE Public/Granted day:2021-03-04
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