Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16789893Application Date: 2020-02-13
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Publication No.: US11270833B2Publication Date: 2022-03-08
- Inventor: Masashi Shimoyasu , Shinichi Sato , Seiichi Nakagawa , Mamoru Kawauchi , Shigetoshi Kinouchi , Mitsuru Ito
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-107490 20160530,JP2016-107491 20160530,JP2016-107493 20160530
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F17/00 ; H01F27/29 ; H01F27/32

Abstract:
A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
Public/Granted literature
- US11239020B2 Multilayer coil component Public/Granted day:2022-02-01
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