公开(公告)号：US12176134B2

公开(公告)日：2024-12-24

申请号：US18378815

申请日：2023-10-11

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito ,  Yuto Shiga

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US11270833B2

公开(公告)日：2022-03-08

申请号：US16789893

申请日：2020-02-13

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US11817252B2

公开(公告)日：2023-11-14

申请号：US17573301

申请日：2022-01-11

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F27/324 ,  H01F2027/2809

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US11239020B2

公开(公告)日：2022-02-01

申请号：US16789893

申请日：2020-02-13

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.