公开(公告)号：US12125627B2

公开(公告)日：2024-10-22

申请号：US17337985

申请日：2021-06-03

Applicant: TDK CORPORATION

Inventor： Daiki Kato ,  Masashi Shimoyasu ,  Yoji Tozawa ,  Seiichi Nakagawa ,  Akihiko Oide ,  Makoto Yoshino ,  Kazuhiro Ebina

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F41/041 ,  H01F2027/2809

Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.

公开(公告)号：US11894195B2

公开(公告)日：2024-02-06

申请号：US17521500

申请日：2021-11-08

Applicant: TDK CORPORATION

Inventor： Yoji Tozawa ,  Masashi Shimoyasu ,  Makoto Yoshino ,  Takuo Abe ,  Akihiko Oide ,  Tsutomu Ono ,  Shinichi Sato ,  Makoto Morita ,  Shinichi Sato ,  Hidekazu Sato

IPC: H01F27/32 ,  H01F27/29 ,  H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H03H7/42 ,  H01F17/00 ,  H01G4/12 ,  H03H1/00 ,  H05K3/34

CPC classification number: H01G4/2325 ,  H01B1/22 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F27/32 ,  H01F27/324 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30 ,  H01G13/006 ,  H03H7/427 ,  H05K1/0306 ,  H01F2017/0066 ,  H01F2017/0093 ,  H01G4/12 ,  H03H2001/0057 ,  H03H2001/0085 ,  H05K3/3442 ,  H05K2201/1006 ,  H05K2201/10636

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US11373789B2

公开(公告)日：2022-06-28

申请号：US16234921

申请日：2018-12-28

Applicant: TDK CORPORATION

Inventor： Takeshi Shibayama ,  Yukio Takahashi ,  Takashi Suzuki ,  Hiroyuki Tanoue ,  Masashi Shimoyasu ,  Masahiro Kato

IPC: H01F1/36 ,  H01F17/04 ,  C04B35/626 ,  H01F17/00 ,  H01F1/34 ,  C04B35/26 ,  H01F27/28 ,  H01F27/40 ,  H01F41/04

Abstract: A ferrite sintered body of the invention includes; a main component including 48.65 to 49.45 mol % of iron oxide in terms of Fe2O3, 2 to 16 mol % of copper oxide in terms of CuO, 28.00 to 33.00 mol % of zinc oxide in terms of ZnO, and a balance including nickel oxide, and a subcomponent including boron oxide in an amount of 5 to 100 ppm in terms of B2O3 with respect to 100 parts by weight of the main component, in which the ferrite sintered body includes crystal grains having an average crystal grain size of 2 to 30 μm.

公开(公告)号：US11270833B2

公开(公告)日：2022-03-08

申请号：US16789893

申请日：2020-02-13

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US11227721B2

公开(公告)日：2022-01-18

申请号：US15821998

申请日：2017-11-24

Applicant: TDK CORPORATION

Inventor： Yoji Tozawa ,  Masashi Shimoyasu ,  Makoto Yoshino ,  Takuo Abe ,  Akihiko Oide ,  Tsutomu Ono ,  Shinichi Sato ,  Makoto Morita ,  Shinichi Sato ,  Hidekazu Sato ,  Masashi Kitazaki ,  Naoki Uchida ,  Masahiro Kato

IPC: H01F27/29 ,  H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H03H7/42 ,  H01F17/00 ,  H01F27/32 ,  H01G4/12 ,  H03H1/00 ,  H05K3/34

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US12094642B2

公开(公告)日：2024-09-17

申请号：US17329348

申请日：2021-05-25

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Daiki Kato ,  Yoji Tozawa ,  Takashi Endo ,  Seiichi Nakagawa ,  Mitsuru Ito ,  Kenta Sasaki ,  Akihiko Oide ,  Makoto Yoshino ,  Kazuhiro Ebina

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04

CPC classification number: H01F27/29 ,  H01F27/2804 ,  H01F41/043 ,  H01F2027/2809

Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.

公开(公告)号：US11817252B2

公开(公告)日：2023-11-14

申请号：US17573301

申请日：2022-01-11

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F27/324 ,  H01F2027/2809

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US11239020B2

公开(公告)日：2022-02-01

申请号：US16789893

申请日：2020-02-13

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US12176134B2

公开(公告)日：2024-12-24

申请号：US18378815

申请日：2023-10-11

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Shinichi Sato ,  Seiichi Nakagawa ,  Mamoru Kawauchi ,  Shigetoshi Kinouchi ,  Mitsuru Ito ,  Yuto Shiga

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.

公开(公告)号：US20240321503A1

公开(公告)日：2024-09-26

申请号：US18599609

申请日：2024-03-08

Applicant: TDK CORPORATION

Inventor： Masashi Shimoyasu ,  Takahiro Yata ,  Masataka Yamamoto ,  Hiroyuki Abe ,  Daiki Saito ,  Akihiko Oide

IPC: H01F27/23 ,  H01F17/00 ,  H01F17/02

CPC classification number: H01F27/23 ,  H01F17/0013 ,  H01F17/02 ,  H01F2017/002

Abstract: An inductor includes: an element body having a pair of end surfaces facing each other, and a side surface extending in a facing direction of the pair of end surfaces to connect the pair of end surfaces; and a through conductor disposed inside the element body and extending in the facing direction. The element body includes a first portion surrounding the through conductor, and a second portion positioned outward of the first portion, when viewed in the facing direction. The first portion is disposed spaced from the side surface. The first portion has a porosity higher than a porosity of the second portion.