Invention Grant
- Patent Title: Wafer handling chamber with moisture reduction
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Application No.: US16423824Application Date: 2019-05-28
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Publication No.: US11270899B2Publication Date: 2022-03-08
- Inventor: Petri Raisanen , Ward Johnson
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/67 ; H01L21/302
Abstract:
An apparatus and method for reducing moisture within a wafer handling chamber is disclosed. The moisture reduction results in reduced oxidation of a wafer. The moisture reduction is made possible through use of valves and purging gas. Operation of the valves may result in improved localized purging.
Information query
IPC分类:
