Invention Grant
- Patent Title: Bare-die smart bridge connected with copper pillars for system-in-package apparatus
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Application No.: US16349170Application Date: 2016-12-29
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Publication No.: US11270941B2Publication Date: 2022-03-08
- Inventor: Georg Seidemann , Thomas Wagner , Andreas Wolter , Bernd Waidhas
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/069176 WO 20161229
- International Announcement: WO2018/125132 WO 20180705
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/00 ; H01L25/065 ; H01L21/768 ; H01L23/48 ; H01L23/532 ; H01L23/538 ; H01L25/16 ; H01L21/56 ; H01L23/498 ; H01L23/31
Abstract:
A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.
Public/Granted literature
- US20190287904A1 BARE-DIE SMART BRIDGE CONNECTED WITH COPPER PILLARS FOR SYSTEM-IN-PACKAGE APPARATUS Public/Granted day:2019-09-19
Information query
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