Invention Grant
- Patent Title: Package with electrical interconnection bridge
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Application No.: US16987002Application Date: 2020-08-06
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Publication No.: US11270946B2Publication Date: 2022-03-08
- Inventor: Yong Chen , David Gani
- Applicant: STMICROELECTRONICS PTE LTD
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/065 ; H01L23/00

Abstract:
The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.
Public/Granted literature
- US20210066198A1 PACKAGE WITH ELECTRICAL INTERCONNECTION BRIDGE Public/Granted day:2021-03-04
Information query
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